$15.00
Every electronic device or circuit generates heat during its operation. The level of heat generated may vary depending on many factors, including but not limited to operating power, component density, or component type. Heat can degrade the performance of any electronic circuit if it is above the local threshold temperature level. Even a small amount of heat over the long run can have negative effects. For any designer, it is crucial to see if the amount of heat generated is within the operating limits of the device. Thermal analysis of any electronic device is very important, as it can identify heat sources and the amount of heat generated at various operating points. This allows the designer to ensure that the required level of cooling counters heat generated during use and keeps the temperature within operating limits. This improves the accuracy of predicting the device’s response over temperature.
Heat can also be generated due to electromagnetic (EM) losses. This course is designed to demonstrate the workflow for electrothermal management (ETM) using HFSS and Icepak inside the student version of Ansys Electronics Desktop.
To download Ansys Electronics Desktop Student version for free, click here.
A course completion badge allows you to showcase your success. We partner with the Credly Acclaim platform, and digital badges can be used in email signatures, digital resumes and social media sites. The digital image contains verified metadata that describes your participation in our course and the topics and skills that were covered. This badge is for successfully completing the ETM using Ansys HFSS and Icepak course.
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You may request a refund for this product if you are dissatisfied with your purchase for any reason within fourteen (14) days of purchase to receive a refund in full. Refunds may take up to four (4) business days to process. Refunds will only be provided if you do not use any amount of the Cloud Access purchased; otherwise, there are no refunds provided for the product. Check out our FAQs for more information.
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